dual inline packages - EAS

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    https://en.wikipedia.org/wiki/Dual_in-line_package

    In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was … See more

    Types of devices
    DIPs are commonly used for integrated circuits (ICs). Other devices in DIP packages include resistor networks, DIP switches, LED segmented and bar graph displays, and … See more

    As shown in the diagram, leads are numbered consecutively from Pin 1. When the identifying notch in the package is at the top, Pin 1 is the top left corner of the device. Sometimes … See more

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    Orientation and lead numbering image

    The body (housing) of a DIP containing an IC chip is usually made from molded plastic or ceramic. The hermetic nature of a ceramic housing is preferred for extremely high reliability devices. However, the vast majority of DIPs are manufactured via a … See more

    The SOIC (Small Outline IC), a surface-mount package which is currently very popular, particularly in consumer electronics and personal computers, is essentially a shrunk … See more

    • Intel (1996). Packaging Databook. Mcgraw-Hill. ISBN 1-55512-254-X. OCLC 906673879. See more

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  2. https://www.sciencedirect.com/topics/computer-science/dual-inline-package

    WebDual in line packages: DIPs come in either plastic or ceramic versions and have two rows of interconnects along two opposite sides of the package. The DIP is a …

  3. What is DIP (dual inline package)? - Computer Notes

    https://ecomputernotes.com/digital-electronics/digital/dual-inline-package

    WebBy Dinesh Thakur. DIP is an acronym that stands for dual inline package and refers to the physical layout of most computer chips. The standard chip looks like a bug, or a little …

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    • https://www.analog.com/en/design-center/packaging...

      WebPlastic Dual Inline Package, Legacy LTC View More CerDIP (Legacy LTC) Ceramic Dual Inline Package, Legacy LTC View More

    • https://embeddedartistry.com/fieldmanual-terms/dual-in-line-package

      WebIn microelectronics, a dual in-line package ( DIP or DIL ), or dual in-line pin package ( DIPP) is an electronic component package with a rectangular housing and two parallel

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      • https://hackaday.com/2018/11/08/the-dual-in-line...

        WebNov 08, 2018 · A 14-pin ceramic flatpack IC. Source: By Tpdwkouaa , from Wikimedia Commons. The three are said to have designed the package in 1964, specifically to house new IC dies with ever-increasing numbers...

      • https://madpcb.com/glossary/dil

        WebIn microelectronics, a dual in-line package ( DIP or DIL ), or dual in-line pin package ( DIPP) is an electronic component package with rectangle housing and two parallel rows

      • https://www.idc-online.com/.../pdfs/electronic_engineering/Dual_inline_package.pdf

        WebDUAL IN-LINE PACKAGE In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and …

      • https://components101.com/articles/different-ic...

        WebDec 18, 2019 · These are the most significantly used IC packages is Dual Inline Packages (DIP). Just like in 28-pin ATmega328, the pins are placed in parallel to each other …

      • https://www.te.com/usa-en/products/connectors/...

        WebOur Dual Inline Package (DIP) sockets with positions ranging from 1 to 48, make it easy to get a highly reliable connection between your IC devices and PCBs. Our large selection …



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