dual inline packages - EAS
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In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was … See more
Types of devices
DIPs are commonly used for integrated circuits (ICs). Other devices in DIP packages include resistor networks, DIP switches, LED segmented and bar graph displays, and … See moreAs shown in the diagram, leads are numbered consecutively from Pin 1. When the identifying notch in the package is at the top, Pin 1 is the top left corner of the device. Sometimes … See more
The body (housing) of a DIP containing an IC chip is usually made from molded plastic or ceramic. The hermetic nature of a ceramic housing is preferred for extremely high reliability devices. However, the vast majority of DIPs are manufactured via a … See more
• Intel (1996). Packaging Databook. Mcgraw-Hill. ISBN 1-55512-254-X. OCLC 906673879. See more
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What is DIP (dual inline package)? - Computer Notes
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