Semiconductor device fabrication A Advanced silicon etching Ampleon Atomic layer deposition Atomic layer etching B B-staging Back end of line Ball bonding Beam lead technology Borophosphosilicate glass Bow and warp of semiconductor wafers and substrates C Capacitance–voltage profiling Chalcogenide chemical vapour deposition Channel-stopper

Semiconductor devices are manufactured both as single discrete devices and as integrated circuit (IC) chips, which consist of two or more devices—which can number from the hundreds to the billions—manufactured and interconnected on …

A semiconductor material has an electrical conductivity value falling between that of a conductor, such as metallic copper, and an insulator, such as glass.Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities ("doping") into the crystal structure.

This page is based on the copyrighted Wikipedia article "Semiconductor_device_fabrication" ; it is used under the Creative Commons Attribution-ShareAlike 3.0 Unported License. You may redistribute it, verbatim or modified, providing that you comply with the terms of …

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically the metal–oxide–semiconductor (MOS) devices used in the integrated circuit (IC) chips that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps (such as surface passivation, thermal …

Advanced Micro Devices, Inc. ( AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets.